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Conclusion of Agreement to Transfer Shares of NEC Toppan Circuit Solutions, Inc.

Entered into share transfer agreement to transfer all shares to Kyocera

Toppan Printing Co., Ltd., NEC Corporation and Kyocera Corporation have entered into a share transfer agreement to transfer to Kyocera all shares of NEC Toppan Circuit Solutions, Inc. (TNCSi), a Toppan Printing subsidiary that manufactures printed wiring boards. Toppan Printing Co., Ltd. had owned 55% of the shares, and NEC Corporation the remaining 45%.

Toppan Printing conducts semiconductor-related business including the manufacture of photomasks, in which the company enjoys a large global market share, and package substrates. This reorganization will enable Toppan to concentrate management resources on the FC-BGA substrate market, which is considered to have significant growth potential due to factors such as the miniaturization of semiconductors.

Toppan will pursue further expansion of its semiconductor-related business by providing customers with a comprehensive service from photomasks used in front-end processes of semiconductor manufacture to package substrates for back-end processes.

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